Plating apparatus

ABSTRACT

A plating apparatus can form a plated film having a uniform thickness over the entire surface of a substrate without a change of members. The plating apparatus included a substrate holder, a cathode contact for contacting a conductive film formed on the substrate so that the conductive film serves as a cathode, a ring-shaped seal member for covering the cathode contact and bringing its inner circumferential portion into contact with the peripheral portion of the substrate to seal the peripheral portion of the substrate, an anode disposed so as to face the conductive film formed on the substrate, and an auxiliary cathode disposed to the seal member such that at least part of the auxiliary cathode expose on a surface of the seal member. Plating is carried out by bringing the conductive film, the anode and the auxiliary cathode into contact with a plating solution.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a plating apparatus, and moreparticularly to a plating apparatus used for filling interconnectrecesses formed in a substrate, such as a semiconductor wafer, with anelectrical conductor (interconnect material), such as copper or silver,so as to form interconnects.

2. Description of the Related Art

In recent years, instead of using aluminum or aluminum alloys as ametallicmaterial for forming interconnect circuits on a substrate; thereis an eminent movement towards using copper (Cu) that has a low electricresistivity and high electromigration resistance. Copper interconnectsare generally formed by filling copper into fine interconnect recessesformed in a surface of a substrate. There are known various techniquesfor forming such copper interconnects, including CVD, sputtering, andplating. According to any such technique, a copper film is formed in asubstantially entire surface of a substrate, followed by removal ofunnecessary copper by performing chemical mechanical polishing (CMP).

FIGS. 1A through 1C illustrate, in a sequence of process steps, anexample of forming such a substrate W having copper interconnects.First, as shown in FIG. 1A, an insulating film 2, such as an oxide filmof SiO₂ or a Low-k material film, is deposited on a conductive layer 1 aon a semiconductor base 1 having formed semiconductor devices. Contactholes 3 and trenches 4 for interconnect recesses are formed in theinsulating film 2 by performing a lithography/etching technique.Thereafter, a barrier layer 5 of Ta, TaN, TiN, WN, SiTiN, CoWP, CoWB, orthe like is formed on the insulating film 2, and a seed layer(conductive film) 7 as an electric supply layer for electroplating isformed on the barrier layer 5.

Then, as shown in FIG. 1B, copper plating is performed onto a surface ofthe seed layer 7 of the substrate W to fill the contact holes 3 and thetrenches 4 with copper and, at the same time, deposit a copper film 6 onthe insulating layer 2. Thereafter, the copper film 6, the seed layer 7and the barrier layer 5 on the insulating film 2 are removed byperforming chemical mechanical polishing (CMP) so as to make the surfaceof the copper filled in the contact holes 3 and the trenches 4 and thesurface of the insulating film 2 lie substantially on the same plane.Interconnects composed of the copper film 6, as shown in FIG. 1C, arethus formed in the insulating film 2.

SUMMARY OF THE INVENTION

In forming copper interconnects in an insulating film, pre-formation ofa seed layer having a thickness of about 60 to 100 nm on the surfaces oftrenches and contact holes formed in the insulating film is widelypracticed, as described above. A seed layer is a conductive film forflowing a current to a substrate immediately after the start of platingwhen a copper film is not sufficiently grown. A seed layer is formedprior to plating by sputtering or the like.

In recent years, the sizes of trenches and contact holes are becomingsmaller for the purpose of increasing the integration density ofsemiconductor devices. With the trend toward smaller-sized trenches andcontact holes, the following problem has become serious: When a seedlayer 7 having a conventional thickness is formed on a surface of abarrier layer 5 which covers surfaces of smaller-sized trenches 4 andcontact holes 3, the seed layer 7 may considerably hang inwardly overthe openings of the trenches 4 and contact holes 3 such that it blocksin the openings, thus narrowing the openings, as shown in FIG. 2. Thisimpedes electrodeposition of copper in the trenches 4 and contact holes3 in the next plating step, whereby voids are likely to be formed withinthe interconnects formed of a plated film, lowering the reliability ofthe interconnects.

One method to solve the above problem is to make a thickness of a seedlayer 7 smaller. Plating on a thinner seed layer 7, however, entails thefollowing problem. As shown in FIG. 3, the sheet resistance R2 of theseed layer 7 between its center and its peripheral electricity-feedingportion becomes relatively higher than the resistance R1 of a platingsolution 202 present between an anode 200, connected to the anode of aplating power source 206, and the surface seed layer (conductive film) 7of a substrate W, connected to the cathode of the plating power source206 (R1<<R2). As a result, a higher current flows in the peripheralregion, having a lower electric resistance, of the seed layer 7.Accordingly, the plated film produced by plating has a film thicknessprofile as shown in FIG. 4, indicating a thin film in the central regionof the substrate and a gradually thicker film in the peripheral regionof the substrate. When carrying out CMP or the like of the substrate,having such a thick plated film formed in the peripheral region, toremove an extra plated film and flatten an entire surface of thesubstrate, a longer processing (polishing) time is needed in a CMPprocess or the like, thus lowering the productivity.

A known method for improving such an uneven thickness of a plated filmis to interpose a high resistance structure 204 a between the anode 200and the substrate, as shown in FIG. 5. The higher resistance structure204 a allows the plating solution 202 to penetrate into it throughcomplicated paths, and hence has a higher resistance than the resistanceof the plating solution 202 itself. A thickness of the high-resistancestructure 204 a is made to increase gradually with the distance from thecenter to the periphery so as to incline the electric resistancedistribution in the radial direction of the substrate, therebyuniformizing the current density distribution over the substrate.Another known method is to interpose an insulating ring 206 between theanode 200 and a flat plate-shaped high-resistance structure 204 b intheir peripheral regions, as shown in FIG. 6. The shielding of electriccurrent by the insulating ring 206 can prevent an excessive current fromflowing locally (peripheral region of the substrate).

These methods, however, necessitate additionally preparing, for example,a high-resistance structure 204 a having a different thicknessdistribution or an insulating ring 206 having a different width, andreplacing the old one with such new one whenever a thickness of a platedfilm obtained by plating falls out of its standard. This not onlyincreases the component cost, but also entails downtime in an actualsemiconductor device manufacturing process, resulting in a loweredthroughput.

A method has also been proposed in which a lattice-like or net-likeauxiliary cathode, which can control the current proportion, is disposedbetween a substrate and an anode, and a voltage is applied, besidesbetween the anode and the substrate, also between the anode and theauxiliary cathode in carrying out plating, thereby improving theuniformity of a thickness of a plated film (see Japanese PatentLaid-Open Publication No. 2006-89810). However, in view of the fact thatsuch auxiliary cathode covers the entire surface (surface to be plated)of the substrate, it is considered that the uniformity of a plated filmcannot be improved selectively in the vicinity of a cathode contact,i.e., in the outermost peripheral region of the substrate, where aplated film is likely to become thick due to concentration of electriccurrent.

The present invention has been made in view of the above situation inthe related art. It is therefore an object of the present invention toprovide a plating apparatus which can form a plated film having auniform thickness over the entire surface, including the peripheralsurface, of a substrate without a change of members even when aconductive film, such as a seed layer, has a small thickness.

In order to achieve the above object, the present invention provides aplating apparatus including: a substrate holder for holding a substrate;a cathode contact for contacting a conductive film formed on thesubstrate held by the substrate holder to feed electricity to theconductive film so that the conductive film serves as a cathode; aring-shaped seal member for covering the cathode contact and bringingits inner circumferential portion into contact with the peripheralportion of the substrate held by the substrate holder to seal theperipheral portion of the substrate; an anode disposed so as to face theconductive film formed on the substrate held by the substrate holder;and an auxiliary cathode mounted to the seal member such that at least apart of the auxiliary cathode expose on a surface of the seal member.Plating is carried out by bringing the conductive film, the anode andthe auxiliary cathode into contact with a plating solution.

There is a case in which due to a thinness of a conductive film, such asa seed layer, a plated film is formed by ordinary plating, which filmhas such a profile that the thickness gradually increases with distancefrom the center of a substrate and increases sharply in the vicinity ofa cathode contact, i.e., in the outermost peripheral region of thesubstrate. According to the present invention, a voltage is applied,besides between the anode and a substrate, also between the anode andthe auxiliary cathode in carrying out plating. This allows an excessiveelectric current, flowing from the anode toward the substrate in thevicinity of the periphery of the substrate, to flow into the auxiliarycathode, thereby reducing a thickness of a plated film selectively inthe peripheral region of the substrate and thus improving the in-planeuniformity of the thickness of the plated film formed.

Further, by providing the auxiliary cathode in the seal member such thatthe auxiliary cathode is either formed integrally with the seal memberor fixed on the seal member, good accessibility of a worker, engaging inmaintenance of the apparatus, to the auxiliary cathode can be secured,facilitating maintenance of the apparatus.

Preferably, the plating apparatus comprises a high-resistance structuredisposed between the anode and the substrate.

By thus disposing the high-resistance structure, which is made to have ahigher resistance than the resistance of a plating solution itself,between the anode and the substrate, the influence of the resistance ofa conductive film, such as a seed layer, formed in the surface (surfaceto be plated) of the substrate, can be made as small as negligible. Thiscan reduce an in-plane difference in current density due to the surfaceelectric resistance of the substrate, thus enhancing the in-planeuniformity of a plated film.

Preferably, the plating apparatus comprises a control section forcontrolling a voltage applied between the auxiliary cathode and theanode, or a current flowing between the auxiliary cathode and the anode.

This makes it possible to carry out plating with an appropriate voltageor current applied between the auxiliary cathode and the anode.

Preferably, the plating apparatus comprises an auxiliary cathodecleaning section for cleaning a surface of the auxiliary cathode.

When plating is carried out by supplying an electric current between theauxiliary cathode and the anode, a plated film is formed on a surface ofthe auxiliary cathode. The unnecessary plated film formed on the surfaceof the auxiliary cathode can be cleaned off with a cleaning agentsupplied from the auxiliary cathode cleaning section, for example. Anorganic or inorganic acid, such as sulfuric acid, hydrochloric acid,phosphoric acid, hydrofluoric acid or formic acid, or a mixture of suchan acid with hydrogen peroxide, can be used effectively as the cleaningagent. Hydrogen peroxide may be used singly. In this case, the auxiliarycathode can be cleaned by supplying a plating solution and hydrogenperoxide simultaneously to the auxiliary cathode.

The auxiliary cathode cleaning section may include a cleaning electrodeor dummy substrate, and be adapted to etch away a plated film formed ona surface of the auxiliary cathode by making the auxiliary cathode serveas an anode and the cleaning electrode or dummy substrate as a cathode.

The plating apparatus of the present invention makes it possible toeasily correct a thickness profile of a plated film simply by adjustingthe current applied to the auxiliary cathode. This enables a lower-costand flexible apparatus operation in a semiconductor device manufacturingprocess. Further, the provision of the auxiliary cathode in the sealmember by forming the auxiliary cathode integrally with the seal memberor fixing the auxiliary cathode on the seal member, can secure goodaccessibility of the maintenance worker to the auxiliary cathode,facilitating maintenance of the apparatus. Further, by adding a cleaningfunction of the auxiliary cathode, maintenance can be quite simplified.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A through 1C are diagrams illustrating, in a sequence of processsteps, a process for producing copper interconnects on a substrate;

FIG. 2 is a cross-sectional diagram illustrating a substrate when arelatively thick seed layer is formed on surfaces of narrow contactholes and narrow trenches;

FIG. 3 is a schematic circuit diagram showing a plating circuitincluding the resistance of plating solution and the sheet resistance ofa seed layer;

FIG. 4 is a diagram showing a film thickness profile of a plated filmformed on a thin seed layer;

FIG. 5 is a diagram showing the main portion of a conventional platingapparatus;

FIG. 6 is a diagram showing the main portion of another conventionalplating apparatus;

FIG. 7 is an overall plan view of a substrate processing apparatusincorporating a plating apparatus according to an embodiment of thepresent invention;

FIG. 8 is a plan view of the plating apparatus shown in FIG. 7;

FIG. 9 is a schematic cross-sectional diagram showing an electrode headand a substrate holder of the plating apparatus shown in FIG. 7;

FIG. 10 is a plan view showing an auxiliary cathode of the platingapparatus shown in FIG. 7;

FIG. 11 is a diagram showing a cleaning agent jet nozzle (auxiliarycathode cleaning section) of the plating apparatus shown in FIG. 7;

FIG. 12 is a schematic circuit diagram of the plating apparatus shown inFIG. 7;

FIG. 13 is a graph showing the relationship between the normalized filmthicknesses and the distance from the center of a substrate (wafer) ofplated films as formed on the substrate surface by plating with variouscurrent values between an anode and an auxiliary cathode;

FIG. 14A is a plan view showing another auxiliary cathode, and FIG. 14Bis a cross-sectional view showing the auxiliary cathode mounted to aseal member;

FIG. 15A is a plan view showing yet another auxiliary cathode, and FIG.15B is a cross-sectional view showing the auxiliary cathode mounted to aseal member;

FIG. 16 is a cross-sectional view showing yet another auxiliary cathodemounted to a seal member;

FIG. 17 is a schematic circuit diagram showing another plating circuit;

FIG. 18 is a schematic circuit diagram showing yet another platingcircuit;

FIG. 19 is a schematic diagram showing another auxiliary cathodecleaning section;

FIG. 20 is a schematic diagram showing yet another auxiliary cathodecleaning section.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Preferred embodiments of the present invention will now be described indetail with reference to the drawings. The following embodiments relateto the application of the present invention useful for forminginterconnects of copper by filling copper into interconnect recesses,such as contact holes 3 and trenches 4, formed in a insulating film 2 byplating onto a surface of a seed layer 7 as a conductive film havingformed on the surface of the substrate W, as shown in FIG. 1A through1C.

FIG. 7 is an overall plan view of a substrate processing apparatusincorporating a plating apparatus according to an embodiment of thepresent invention. As shown in FIG. 7, this substrate processingapparatus has a facility which houses therein two loading/unloadingunits 10 for housing a plurality of substrates w therein, two platingapparatuses 12 for performing a plating process and processingincidental thereto, a transfer robot 14 for transferring substrates Wbetween the loading/unloading units 10 and the plating apparatuses 12,and plating solution supply equipment 18 having a plating solution tank16.

The plating apparatus 12, as shown in FIG. 8, is provided with asubstrate processing section 20 for performing plating process andprocessing incidental thereto, and a plating solution tray 22 forstoring a plating solution is disposed adjacent to the substrateprocessing section 20. There is also provided an electrode arm section30 having an electrode head 28 which is held at the front end of a swingarm 26 swingable about a rotating shaft 24 and which is swung betweenthe substrate processing section 20 and the plating solution tray 22.Furthermore, a pre-coating/recovering arm 32, and fixed nozzles 34 forejecting pure water or a chemical liquid such as ion water, and also agas or the like toward a substrate are disposed laterally of thesubstrate processing section 20. In this embodiment, three of the fixednozzles 34 are disposed, and one of them is used for supplying purewater.

The substrate processing section 20, as shown in FIG. 9, has avertically moveable substrate holder 36 for detachably holding asubstrate W with its surface (surface to be plated), having a seed layer7 (see FIG. 1A) as a conductive film, facing upwardly by attracting theback surface of the substrate W, and an electrode section 38 locatedabove the substrate holder 36 so as to surround a peripheral portion ofthe substrate holder 36. The substrate holder 36 rotates at an arbitraryacceleration and an arbitrary velocity integrally with the electrodesection 38. Substrate carry-in-and-out openings (not shown) are providedin a sidewall of the plating apparatus 12 facing the transfer robot 14.

The plating solution tray 22 serves to wet a high-resistance structure74 and an anode 98 (to be described later on) of the electrode head 28with a plating solution when plating has not been performed. The platingsolution tray 22 is set at a size in which the high-resistance structure74 can be accommodated, and the plating solution tray 22 has a platingsolution supply port and a plating solution drainage port (not shown). Aphoto-sensor is attached to the plating solution tray 22, and can detectbrimming with the plating solution in the plating solution tray 22,i.e., overflow, and drainage.

The electrode arm section 30 is vertically movable by a verticalmovement motor, which is a servomotor, and a ball screw (not shown), andswingable (pivotable) between the plating solution tray 22 and thesubstrate processing section 20 by a swing motor.

The pre-coating/recovering arm 32 is coupled to an upper end of avertical support shaft. The pre-coating/recovering arm 32 is swingable(pivotable) by a rotary actuator (not shown) and is also verticallymoveable by an air cylinder (not shown). The pre-coating/recovering arm32 supports a pre-coating nozzle (not shown) for intermittentlydischarging a pre-coating liquid, and a plating solution recoveringnozzle (not shown) for drawing and recovering the plating solution onthe substrate, respectively.

The electrode section 38 has cathode contacts 44 comprising six cathodecontacts, in this embodiment, and a ring-shaped seal member 46 disposedabove the cathode contacts 44 so as to cover upper surfaces of thecathode contacts 44. The cathode contacts 44 are provided on top ofsupport posts 42 mounted vertically on the peripheral upper surface of asubstrate stage 40. The seal member 46 has an inner circumferentialportion which is inclined inwardly and downwardly so that a thickness ofthe seal member 46 is gradually reduced.

When the substrate W held by the substrate holder 36 is raised, thecathode contacts 44 are brought into contact with peripheral portions ofthe seed layer 7, formed on the surface of the substrate W, as aconductive film, so that electricity can be fed to the seed layer 7 tobe cathode. At the same time, the inner peripheral end portion of theseal member 46 presses on and water-tightly seals the peripheral uppersurface of the substrate W, thus preventing the plating solution,supplied to the upper surface (surface to be plated) of the substrate W,from leaking from the end of the substrate W and also preventing theplating solution from contaminating the cathode contacts 44.

In this embodiment, the electrode section 38 is not movable vertically,but is rotatable together with the substrate holder 36. However, theelectrode section 38 may be designed to be movable vertically so thatthe seal member 46 is brought into close contact with the surface, to beplated, of the substrate W when the electrode section 38 is moveddownwardly.

A plurality of auxiliary cathodes 48, formed of a metal, such as astainless steel or titanium, and having the shape of a ring as a whole,are mounted on an upper surface of the seal member 46 by a presser ring50 and cap screws 52. In order to avoid dissolution of the auxiliarycathode 48 in a plating solution and to prevent the formation of apassive film in the surface, the surface of the auxiliary cathode 48 maybe coated with a noble metal, such as platinum, e.g., by vapordeposition. As shown in FIG. 10, the auxiliary cathode 48 according tothis embodiment is comprised of an arc-shaped support plate 54, and aplurality of strips 56 having spring properties and bonded to an innerend surface of the support plate 54. Such an auxiliary cathode 48 hasgood adhesion of the strips 56 to the seal member 46 while securingflexibility of the strips 56 and thus can prevent leakage of liquid and,in addition, can eliminate the use of a costly draw mold.

It is also possible to use auxiliary cathodes 48 a, as shown in FIG.14A, having the shape of a ring as a whole. Each auxiliary cathode 48 ais comprised of an arc-shaped support plate 54 having through-holes 54 atherein, and outwardly-projecting mounting pieces 58 provided on anouter end surface of the support plate 54. When mounting the auxiliarycathode 48 a on the surface of the seal member 46 by a presser ring 50and cap screws 52, as shown in FIG. 14B, the outer end portion of thesupport plate 54 of the auxiliary cathode 48 a and the inner end portionof the presser ring 50 overlap with each other linearly, and spaces 60are formed between the seal member 46 and the auxiliary cathodes 48 a.

The auxiliary cathode 48 a can increase the exposed area of the slopeportion of the seal member 46 so that a liquid pool is less likely to beformed on the slope portion. On the other hand, there is a fear withsuch an auxiliary cathode 48 a of a slight leakage of plating solutionthrough a narrow gap, which can be formed between the auxiliary cathode48 a and the seal member 46, upon high-speed rotation of the substrateholder 36. The possible leakage of plating solution, however, can beprevented by creating the spaces 60 between the seal member 46 and theauxiliary cathodes 48 a, and cleaning the spaces 60 with the samerinsing water as that for rinsing of a substrate before rotating thesubstrate holder 36 at a high speed. This can thus prevent a platingsolution from leaking through the gap between the seal member 46 and theauxiliary cathode 48 a and bouncing off a surrounding drip-proof cup,which could cause oxidation and staining of a substrate surface.

Further, it is also possible to use an auxiliary cathode 48 b as shownin FIG. 15A, comprised of an arc-shaped support plate 54 havingthrough-holes 54 a therein, and a bendable plate 62 bonded to the outerend surface of the support plate 54, and to provide a steepledprojection 46 a on the surface of the seal member 46, as shown in FIG.15B, so that when mounting the auxiliary cathode 48 b on the surface ofthe seal member 46 by a presser ring 50 and cap screws 52, theprojection 46 a of the seal member 46 makes pressure contact with thebendable plate 62 of the auxiliary cathode 48 b to effect liquid sealingbetween the seal member 46 and the auxiliary cathode 48 b.

As shown in FIG. 11, beside the electrode section 38 is provided anauxiliary cathode cleaning section comprising cleaning agent jet nozzles64 for jetting a cleaning agent toward the auxiliary cathodes 48 toclean the auxiliary cathodes 48. According to this embodiment, acleaning agent (chemical solution), which may be an inorganic or organicacid, such as sulfuric acid, hydrochloric acid, phosphoric acid,hydrofluoric acid or formic acid, or a mixture of such an acid withhydrogen peroxide, is jetted from the cleaning agent jet nozzles(auxiliary cathode cleaning section) 64 toward the auxiliary cathodes 48to dissolve and remove, for example, an unnecessary plated film formedon surfaces of the auxiliary cathodes 48. Hydrogen peroxide may be usedsingly as a cleaning agent. In this case, the auxiliary cathodes 48 canbe cleaned by supplying the plating solution and hydrogen peroxidesimultaneously to the auxiliary cathodes 48.

When plating is carried out by supplying an electric current between theauxiliary cathodes 48 and the anode 78, as described below, plated filmsare formed on surfaces of the auxiliary cathodes 48. According to thisembodiment, the unnecessary plated films formed on the auxiliarycathodes 48 can be dissolved by chemical etching with the cleaning agent(chemical solution) supplied from the cleaning agent jet nozzles(auxiliary cathode cleaning section) 64 and removed.

As shown in FIG. 9, the electrode head 28 of the electrode arm section30 includes an anode holder 72 which is coupled via a ball bearing (notshown) to the free end of the swing arm 26, and a high-resistancestructure 74 which is disposed such that it closes the lower opening ofthe anode holder 74. A hollow anode chamber 76 is thus defined in theanode holder 72.

The high-resistance structure 74 is, for example, composed of porousceramics such as alumina, SiC, mullite, zirconia, titania or cordierite,or a hard porous material such as a sintered compact of polypropylene orpolyethylene, or a composite material comprising these materials, or awoven fabric or a non-woven fabric. If alumina-based ceramics is used asthe material of the high-resistance structure 74, then it has a porediameter ranging from 30 to 200 μm. If SiC is used as the material ofthe high-resistance structure 74, then it has a pore diameter of 30 μmor less. These ceramics have a porosity ranging from 20 to 95%. Thehigh-resistance structure 74 has a thickness in the range from 1 to 20mm, preferably in the range from 5 to 20 mm, and more preferably in therange from 8 to 15 mm. The high-resistance structure 72, in thisembodiment, is constituted of porous ceramics of alumina having aporosity of 30%, and an average pore diameter of 100 μm. The porousceramic plate per se is an insulator, but the high-resistance structureis constituted so as to have a smaller conductivity than the platingsolution by causing the plating solution to enter its interiorcomplicatedly and follow a considerably long path in the thicknessdirection.

The high-resistance structure 74, which has the higher resistance, isdisposed at the opening of the anode chamber 76. Hence, the influence ofthe resistance of the seed layer 7 becomes a negligible degree.Consequently, the difference in current density over the surface of thesubstrate due to electrical resistance on the surface of the substrate Wbecomes small, and the uniformity of the plated film over the surface ofthe substrate improves.

An anode 78, which has a number of vertical through holes definedtherein, is disposed in the anode chamber 76 located above thehigh-resistance structure 74. The anode holder 72 has a plating solutiondischarge port 80 for discharging, under suction, the plating solutionfrom the anode chamber 76. The plating solution discharge port 80 isconnected to a plating solution discharge pipe (not shown) extendingfrom the plating solution supply equipment 18 (see FIG. 7). A platingsolution introducing portion 82 is provided beside the anode holder 72.In this embodiment, the plating solution introducing portion 82comprises a tube having a lower end shaped as a nozzle, and is connectedto a plating solution supply pipe (not shown) extending from the platingsolution supply equipment 18 (see FIG. 7).

The electrode head 28 is lowered until the gap between the substrate Wheld by the substrate holder 36 and the high-resistance structure 74becomes about 0.5 to 3 mm, for example, and then the plating solutionintroducing portion 82 pours the plating solution into a region betweenthe substrate W and the high-resistance structure 74 from laterally ofthe anode 78 and the high-resistance structure 74.

In order to suppress slime formation, the anode 78 is made of copper(phosphorus-containing copper) containing 0.03 to 0.05% of phosphorus.It is also possible to use an insoluble material for the anode.

As shown in FIGS. 9 and 12, the anode side of a plating power source 90is electrically connected to the anode 78 via an anode-side conductingwire 92, and the cathode side of the plating power source 90 iselectrically connected to each cathode contact 44 via a cathode-sideconducting wire 94. Besides the plating power source 90, the platingapparatus is also provided with an auxiliary power source 96. The anodeside of the auxiliary power source 96 is electrically connected to theanode 78 via an anode-side conducting wire 98, and the cathode side ofthe auxiliary power source 96 is electrically connected to eachauxiliary cathode 48 via a cathode-side conducting wire 100. The platingapparatus also includes a control section 102 for controlling theplating power source 90 and the auxiliary power source 96. Plating ofthe substrate W can thus be carried out by supplying electric currentfrom the plating power source 90 and the auxiliary power source 96 tobetween the anode 78 and the seed layer 7 of the substrate W and betweenthe anode 78 and the auxiliary cathodes 48.

Next, the operation of the substrate processing apparatus, incorporatingthe plating apparatus 12 of this embodiment, will now be described.

First, a substrate W before plating is taken by the transfer robot 14out of the loading/unloading section 10, and the substrate W, with itsfront surface (surface to be plated) facing upwardly, is carried intoone of the plating apparatuses 12 through the substrate carry-in-and-outopening provided in the sidewall of the frame. The substrate holder 36attracts and holds the substrate W on its back surface (lower surface).After retreating the hand of the robot, the substrate holder 36 israised to bring the cathode contacts 44 into contact with the seed layer7 of the substrate W so that electricity can be fed to the seed layer 7,while the seal member 46 contacts the peripheral end surface of thesubstrate W to water-tightly seal the peripheral end surface.

Meanwhile, the electrode head 28 of the electrode arm section 30 is in anormal position over the plating solution tray 22, and thehigh-resistance structure 74 or the anode 78 is positioned in theplating solution tray 22. Then, the plating solution starts beingsupplied to the plating solution tray 22 and the electrode head 28.Until the step of plating the substrate W is initiated, the new platingsolution is supplied, and the plating solution discharge pipe (notshown) is evacuated to replace the plating solution in thehigh-resistance structure 74 and remove air bubbles from the platingsolution in the high-resistance structure 74.

Next, the pre-coating step is initiated. Specifically, the substrateholder 36, which has received the substrate W, is rotated, and thepre-coating/recovering arm 32 is moved from the retracted position to aposition confronting the substrate W. When the rotational speed of thesubstrate holder 36 reaches a preset value, the pre-coating nozzle (notshown) mounted on the tip end of the pre-coating/recovering arm 32intermittently discharges a pre-coating liquid which comprises asurfactant, for example, toward the surface (surface to be plated) ofthe substrate W. At this time, since the substrate holder 36 isrotating, the pre-coating liquid spreads all over the surface of thesubstrate W. Then, the pre-coating/recovering arm 32 is returned to theretracted position, and the rotational speed of the substrate holder 36is increased to spin the pre-coating liquid off and dry the surface tobe plated of the substrate W.

After the completion of pre-coating, the process goes on to plating.First, the rotation of the substrate holder 36 is stopped or slowed downto a plating speed. Based on a signal indicating the completion ofpre-coating of the substrate W, the electrode arm section 30 is pivotedhorizontally to move the electrode head 28 from the position above theplating solution tray 22 to a position above a plating position.Thereafter, the electrode head 28 is lowered toward the electrodesection 38, and stopped when the high-resistance structure 74 comes to aposition close to the surface of the substrate W, e.g., at a distance ofabout 0.5 mm to 3 mm from the substrate W. When the lowering of theelectrode head 28 is completed, the plating solution is supplied betweenthe substrate W and the high-resistance structure 74 to bring the anode78, the surface seed layer 7 (see FIG. 1A) of the substrate W and partof each auxiliary cathode 48 into contact with the plating solution.Then, the anode of the plating power source 90 is electrically connectedto the anode 78, while the cathode of the plating power source 90 iselectrically connected to the cathode contacts 44. Further, the anode ofthe auxiliary power source 96 is electrically connected to the anode 78,while the cathode of the auxiliary power source 96 is electricallyconnected to the auxiliary cathodes 48. Thus, plating is carried out bysupplying electric currents between the anode 78 and the seed layer 7,and between the anode 78 and the auxiliary cathodes 48 via the powersource 96 and the auxiliary power source 96. During plating, thesubstrate W held by the substrate holder 36 is rotated at a low speed,according to necessity.

By supplying electric currents between the anode 78 and the seed layer 7of the substrate W, and also between the anode 78 and the auxiliarycathodes 48 disposed such that they surround the periphery of thesubstrate W held by the substrate holder 36 in carrying out plating, itbecomes possible to uniformize the density of electric lines of forceover the entire surface, including the peripheral surface, of thesubstrate W, thereby forming a plated film having a uniform thicknessover the entire surface of the substrate.

The auxiliary power source 96 preferably is controlled by the controlsection 102 so that it operates in two modes: a constant-voltage mode ofoutputting a constant voltage; and a constant-current mode of outputtinga constant current irrespective of load resistance. While the auxiliarycathodes 48 are getting immersed in the plating solution upon injectionof the plating solution, the auxiliary power source 96 is set in theconstant-voltage mode to apply a constant voltage between the auxiliarycathodes 48 and the anode 78, thus passing an electric current, which isproportional to the contact area of the auxiliary cathodes 48 with theplating solution, between the auxiliary cathodes 48 and the anode 78.This can keep the current density between the auxiliary cathodes 48 andthe anode 78 constant, thereby avoiding breakage of the auxiliarycathodes 48 due to abnormal concentration of electric current and burntplating in the substrate surface which may occur in the vicinity of thecurrent concentration site.

After starting plating after completion of the injection of platingsolution, the auxiliary power source 96 is switched to theconstant-current mode to pass a constant electric current, controlled bythe control section 102, between the auxiliary cathodes 48 and the anode78 irrespective of individual differences of the auxiliary cathodes 48and a change in the resistivity of the plating solution, so that platingcan be carried out while applying the intended auxiliary cathodecurrent. Table 1 below shows an example of a stepwise current recipe forapplying optimal electric currents according to the progress of theformation of interconnects.

TABLE 1 power source plating voltage/ auxiliary power auxiliary anodevoltage/ Step time mode current value source mode current value 1  5 secconstant  5 V OFF OFF voltage 2 10 sec constant 10 A OFF OFF current 320 sec constant 15 A OFF OFF current 4 30 sec constant 20 A constantcurrent 1 A current

After the completion of plating, the plating power source 90 and theauxiliary power source 96 are disconnected, and the electrode armsection 30 is raised and pivoted to return the electrode head 28 toabove the plating solution tray 22, and is then lowered to the normalposition. Next, the pre-coating/recovering arm 32 is moved from theretreat position to a position above the substrate W and is thenlowered. A residual plating solution on the substrate W is recovered bythe plating solution recovery nozzle (not shown). After completion ofthe recovery of the residual plating solution, thepre-coating/recovering arm 32 is returned to the retreat position, andpure water is supplied from the fixed pure water nozzle 34 to thecentral portion of the substrate W to rinse the plated surface of thesubstrate while rotating the substrate holder 36 at an increased speed,thereby replacing the plating solution on the substrate W with purewater.

Next, while rotating the substrate holder 36, a cleaning agent (chemicalsolution), such as a mixture of sulfuric acid with hydrogen peroxide, isjetted from the cleaning agent jet nozzles (auxiliary cathode cleaningsection) 64 toward the auxiliary cathodes 48 to dissolve and remove, forexample, an unnecessary plated film formed on surfaces of the auxiliarycathodes 48 by chemical etching. Thereafter, the surfaces of theauxiliary cathodes 48 are rinsed with pure water.

While rotating the substrate holder 36, pure water is supplied from thefixed pure water nozzle 34 to clean the substrate W. After stopping thesupply of pure water from the fixed nozzle 34, the rotational speed ofthe substrate holder 36 is increased to drain off pure water on thesurface of the substrate by centrifugal force.

All the process steps, i.e., the plating step and the associatedpre-coating and cleaning/drying steps, are thus completed. The transferrobot 14 inserts its hand through the substrate carry-in-and-out openinginto below the substrate W and raises the hand to receive the processedsubstrate W from the substrate holder 36, and then returns the substrateW to the loading/unloading section 10.

By thus applying a plating voltage (current) between the anode 78 andthe cathode contacts 44 while applying a current (voltage) between theanode 78 and the auxiliary cathodes 48, and controlling the voltages(currents) applied, especially the current flowing between the anode 78and the auxiliary cathodes 48, by the control section 102, it becomespossible to control a thickness of a plated film being formed on thesurface (surface of the seed layer 7) of the substrate W and provide aflatter plated film over the entire surface of the substrate W.

FIG. 13 shows the relationship between the normalized film thicknessesand the distance from the center of substrate (wafer) of plated films asformed on the surface of the substrate by plating with various currentvalues between the anode 78 and the auxiliary cathodes 48, specifically250 mA, 500 mA, 750 mA and 1000 mA. As can be seen from FIG. 13, achange in the plating current flowing between the anode 78 and theauxiliary cathodes 48 produces a change in a thickness of a plated film,especially in the peripheral region of the substrate. It will,therefore, be understood that a flatter plated film can be formed overthe entire surface of the substrate without a change of members bycontrolling the plating current flowing between the anode 78 and theauxiliary cathodes 48 depending on the plating conditions, the state ofthe substrate, etc.

FIG. 16 shows another auxiliary cathode. The auxiliary cathode 49, forthe most part, is embedded in the seal member 46 with only an exposedportion 49 a partly exposed on the surface of the seal member 46. Theauxiliary cathode 49 permits the formation of an unnecessary plated filmonly on the exposed portion 49 a during plating, thus reducing the areaof unnecessary plated film formation.

FIGS. 17 and 18 schematically show other electric circuit constructions.The electric circuit shown in FIG. 17 is not provided with an auxiliarypower source, and applies part of the voltage form the plating powersource 90 to between the auxiliary cathodes 48 and the anode 78 byswitching a switch 110. The electric circuit shown in FIG. 18 uses avariable resistor 112 instead of the switch 110 of FIG. 17 to apply partof the voltage from the plating power source 90 to between the auxiliarycathodes 48 and the anode 78, and controls the voltage applied bychanging the resistance of the variable resistor 112. The electriccircuits shown in FIGS. 17 and 18, which both employ the sole powersource, have the advantages of lower cost and space saving.

FIG. 19 shows another auxiliary cathode cleaning section. This auxiliarycathode cleaning section includes an auxiliary power source 120 capableof reversing the polarity, which is employed in place of theabove-described auxiliary power source 96, and a dummy substrate 122having a film of, e.g., copper formed on a surface. When the spacebetween the anode 78 and the dummy substrate 122, held by the substrateholder 36 (see FIG. 9), is filled with a plating solution with part ofeach auxiliary cathode 48 in contact with the plating solution, such avoltage as to make the anode 78 serve as a cathode and the auxiliarycathodes 48 an anode, is applied from the auxiliary power source 120 tobetween the anode 78 and the auxiliary cathodes 48, thereby cleaningoff, by etching, plated films of, e.g., copper formed on surfaces of theauxiliary cathodes 48.

FIG. 20 shows yet another auxiliary cathode cleaning section. Thisauxiliary cathode cleaning section includes an auxiliary power source120 capable of reversing the polarity, which is employed in place of theabove-described auxiliary power source 96, a rod-like cleaning electrode130, and an electrolytic solution tank 134 holding an electrolyticsolution 132. The cleaning electrode 130 is vertically mounted to thefree end of a support arm 138 coupled to the upper end of a rotatableand vertically-movable support shaft 136, and is movable between aposition at which the lower end of the cleaning electrode 130 isimmersed in a plating solution held on the upper surface of a substrateW and a position at which the lower end cleaning electrode 130 isimmersed in the electrolytic solution 132 in the electrolytic solutiontank 134. The electrolytic solution tank 134 is provided at the bottomwith a dummy cathode 142 which, during cleaning of the auxiliarycathodes 48, is connected to the cathode of the auxiliary power source120 by a switch 140.

In operation, the lower end of the cleaning electrode 130 is immersed inthe plating solution, held on the upper surface of the substrate W,after the completion of plating, and such a voltage as to make thecleaning electrode 130 serve as a cathode and the auxiliary cathodes 48an anode, is applied from the auxiliary power source 120 to between thecleaning electrode 130 and the auxiliary cathodes 48, thereby cleaningoff, by etching, plated films of, e.g., copper formed on surfaces of theauxiliary cathodes 48. After thus cleaning the auxiliary cathodes 48,the lower end of the cleaning electrode 130 is immersed in theelectrolytic solution 132 in the electrolytic solution tank 134, andsuch a voltage as to make the cleaning electrode 130 serve as an anodeand the dummy cathode 142 a cathode, is applied from the auxiliary powersource 120 to between the cleaning electrode 130 and the dummy cathode142, thereby etching away a plated film of, e.g., copper formed on thelower end portion of the cleaning electrode 130 during the cleaning ofthe auxiliary cathodes 48.

Though the above embodiments are adapted to hold a substrate face up incarrying out plating of the substrate, the present invention is alsoapplicable to plating method that hold a substrate face down in carryingout plating of the substrate. Further, though copper is used as aninterconnect material in the above embodiments, it is also possible touse a copper alloy, silver or a silver alloy.

Although certain preferred embodiments of the present invention havebeen shown and described in detail, it should be understood that variouschanges and modifications may be made therein without departing from thescope of the appended claims.

1. A plating apparatus comprising: a substrate holder for holding asubstrate; a cathode contact for contacting a conductive film formed onthe substrate held by the substrate holder to feed electricity to theconductive film so that the conductive film serves as a cathode; aring-shaped seal member for covering the cathode contact and bringingits inner circumferential portion into contact with the peripheralportion of the substrate held by the substrate holder to seal theperipheral portion of the substrate; an anode disposed so as to face theconductive film formed on the substrate held by the substrate holder;and an auxiliary cathode mounted to the seal member such that at leastpart of the auxiliary cathode expose on a surface of the seal member;wherein plating is carried out by bringing the conductive film, theanode and the auxiliary cathode into contact with a plating solution. 2.The plating apparatus according to claim 1 further comprising ahigh-resistance structure disposed between the anode and the substrate.3. The plating apparatus according to claim 1 further comprising acontrol section for controlling a voltage applied between the auxiliarycathode and the anode, or a current flowing between the auxiliarycathode and the anode.
 4. The plating apparatus according to claim 1further comprising an auxiliary cathode cleaning section for cleaning asurface of the auxiliary cathode.
 5. The plating apparatus according toclaim 4, wherein the auxiliary cathode cleaning section includes acleaning electrode or dummy substrate, and is adapted to etch away aplated film formed on a surface of the auxiliary cathode by making theauxiliary cathode serve as an anode and the cleaning electrode or dummysubstrate as a cathode.